FEATURE : 5G:
Achieving affordability involves utilizing costeffective packaging materials and processes , along with essential miniaturization efforts for seamless integration into consumer devices such as smartphones .
Additionally , meeting other prerequisites involves fabricating high-gain , broadband mmWave antenna arrays while simultaneously addressing electromagnetic compatibility , signal integrity and power integrity concerns .
Integration of quality factor passives into the package ensures optimal performance , with reliability maintained through efficient thermal dissipation .
Scalability further enables module design adaptation to diverse application needs .
More discussion regarding AiP technology can be found in IDTechEx ’ s report Antenna in Package ( AiP ) for 5G and 6G 2024 – 2034 : Technologies , Trends , Markets .
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