FEATURE : 5G y
Understand the landscape of 6G , including potential spectrum , enabling THz communication technologies , key research and industry activities , roadmap , technical targets and applications .
Deep dive into beamforming technologies enabled by phased array antenna for 5G mmWave :
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Compares beamforming technologies of 5G sub-6 vs mmWave . Examines phased array technologies , including antenna , semiconductor , and packaging integration components , technical requirements , trends and design considerations .
Antenna integration technologies for 5G mmWave :
y Discusses antenna substrate technology , benchmarking , material requirements and packaging for phased arrays . y
Explores various antenna packaging technologies for 5G mmWave , including antenna on PCB and antenna in package ( AiP ), categorized by packaging technologies : Flip-chip vs fan-out . Also , discusses substrate material choices , such as LTCC , low-loss organic-based , and glass , covering production challenges , material choices and benchmarks , solutions / case studies from key players , and substrate design considerations for each packaging technology .
Antenna integration technologies for applications beyond 100 GHz :
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Addresses challenges in 6G transceiver development , focusing on power requirements , antenna gain , and phased array demands . Discusses various potential packaging technologies for beyond 100 GHz applications , covering thermal management options and lowloss material choices for antenna substrates . Include case studies showcasing D-band ( 110 – 170 GHz ) phased array technology . p
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